Indium-based solder melt at 275° F (150° lower than lead-tin solders, with a much higher wetting ability). Specific gravity is 8.6, while the bonding holding strength is 4,000lbs PSI. Will never tarnish contains no silver or bismuth and will solder to platinum, golds, silver and numerous alloys. Solid-state components can be soldered without using a heat sink. Repairs to printed circuit boards are simple as the low melting point will not damage the board. use with any Flux, rosin, chloride or acid.WARNING: This product can expose you to chemicals including LEAD, which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov